Standard cell design layout

ABSTRACT

Among other things, one or more techniques and/or systems for performing design layout are provided. In an example, a design layout corresponds to a layout of a standard cell whose connectivity is described by a netlist. For example, the netlist specifies net types for respective vias of the standard cell. One or more connectivity rings are formed within the design layout to provide connectivity for one or more vias of the design layout. For example, a first connectivity ring is generated, such as from mandrel, to connect one or more ring one vias. A second connectivity ring is generated, such as from passive pattern, to connect one or more ring two vias. One or more cuts are generated within the design layout to isolate vias having different net types. In this way, the design layout is self-aligned double patterning (SADP) compliant.

RELATED APPLICATION(S)

This application is a divisional of and claims benefit to U.S. patentapplication Ser. No. 13/751,264, filed on Jan. 28, 2013 and originallytitled “STANDARD CELL DESIGN LAYOUT,” The title of U.S. patentapplication Ser. No. 13/751,264 was amended during prosecution to be“MULTIPLE VIA CONNECTIONS USING CONNECTIVITY RINGS.” U.S. patentapplication Ser. No. 13/751,264 is incorporated herein by reference.

BACKGROUND

Electronic design tools allow designers to layout, simulate, and analyzeelectronic components, such as standard cells and integrated circuits.In an example, a designer may create a design layout for a standardcell. Once the design layout, without considering self-aligned doublepatterning (SADP), is complete, complex post processing is used to makethe design layout SADP compliant. For example, the design layout isadjusted using mandrel pattern and one or more cuts utilized to definepassive pattern. Adding mandrel, such as assist mandrel, for SADPcompliance can lead to area penalty of the standard cell and designflexibility degradation.

SUMMARY

This summary is provided to introduce a selection of concepts in asimplified form that are further described below in the detaileddescription. This summary is not intended to identify key factors oressential features of the claimed subject matter, nor is it intended tobe used to limit the scope of the claimed subject matter.

One or more techniques and systems for performing design layout areprovided herein. In some embodiments, the design layout corresponds to astandard cell. The standard cell is configured to provide functionality,such as logic-based functionality or storage functionality. For example,the standard cell comprises one or more transistors and one or moreinterconnect structures, such as vias. A netlist for the design layoutdescribes connectivity of the standard cell. For example, the netlistspecifies net types for respective vias within the design layout. A nettype identifies a via as belonging to a particular net. The netlist canbe used to perform design layout of the standard cell, such that thedesign layout is self-aligned double patterning (SADP) layout compliant,as provided herein.

Accordingly, a first connectivity ring is generated within the designlayout. The first connectivity ring is generated from a firstconnectivity material type, such as mandrel or passive pattern. Thefirst connectivity ring provides connectivity for one or more ring onevias. For example, a ring one via is a via that is connected by thefirst connectivity ring. In an example, responsive to the firstconnectivity ring connecting a first ring one via to a second ring onevia, where the first ring one via has a net type that is different thana net type of the second ring one via, a first cut is applied to thefirst connectivity ring to isolate the first ring one via from thesecond ring one via. In this way, one or more cuts are performed on thefirst connectivity ring so that ring one vias of different net types areisolated from one another.

A second connectivity ring is generated within the design layout. Thesecond connectivity ring is generated from a second connectivitymaterial type that is different than the first connectivity materialtype. In an example, the first connectivity material type corresponds tomandrel, while the second connectivity material type corresponds topassive pattern or a material type that is different than mandrel. In anexample, the first connectivity material type corresponds to passivepattern, while the first connectivity material type corresponds tomandrel or a material type that is different than passive pattern.. Thesecond connectivity ring provides connectivity for one or more ring twovias. For example, a ring two via is a via that is connected by thesecond connectivity ring. In an example, responsive to the secondconnectivity ring connecting a first ring two via to a second ring twovia, where the first ring two via has a net type that is different thana net type of the second ring two via, a second cut is applied to thesecond connectivity ring to isolate the first ring two via from thesecond ring two via. In this way, one or more cuts are performed on thesecond connectivity ring so that ring two vias of different net typesare isolated from one another. In some embodiments, one or moreadditional connectivity rings are generated and cut to isolate vias ofdifferent net types.

Connecting one or more vias using connectivity rings provides improveddirect control over electrical characteristics of devices representedwithin the design layout. In an example, the developer has improvedcontrol on self-aligned double patterning (SADP) lithography variations,such as swap cuts or cross-circle connectors, and electricalcharacteristics of the devices. For example, relatively wide metalportions within the design layout can be reduced by using at least oneof a swap cut or a cross-circle connector.

The following description and annexed drawings set forth certainillustrative aspects and implementations. These are indicative of but afew of the various ways in which one or more aspects can be employed.Other aspects, advantages, and novel features of the disclosure willbecome apparent from the following detailed description when consideredin conjunction with the annexed drawings.

DESCRIPTION OF THE DRAWINGS

FIG. 1 is a component block diagram illustrating an exemplary system forperforming design layout, according to some embodiments.

FIG. 2 is a flow diagram illustrating an example method of performingdesign layout, according to some embodiments.

FIG. 3 is a simplified top-down view of a design layout, according tosome embodiments.

FIG. 4 is a simplified top-down view of a design layout, according tosome embodiments.

FIG. 5 is a simplified top-down view of a design layout, according tosome embodiments.

FIG. 6 is a simplified top-down view of a design layout, according tosome embodiments.

FIG. 7 is a simplified top-down view of a design layout, according tosome embodiments.

FIG. 8 is a simplified top-down view of a design layout, according tosome embodiments.

FIG. 9 is a simplified top-down view of a design layout, according tosome embodiments.

FIG. 10 is a simplified top-down view of a design layout, according tosome embodiments.

FIG. 11 is a simplified top-down view of a design layout, according tosome embodiments.

FIG. 12 is a simplified top-down view of a design layout, according tosome embodiments.

FIG. 13 is a simplified top-down view of a design layout, according tosome embodiments.

FIG. 14 is an illustration of an example computer-readable mediumwherein processor-executable instructions configured to embody one ormore of the provisions set forth herein may be comprised.

FIG. 15 illustrates an example computing environment wherein one or moreof the provisions set forth herein may be implemented.

DETAILED DESCRIPTION

The claimed subject matter is now described with reference to thedrawings, wherein like reference numerals are generally used to refer tolike elements throughout. In the following description, for purposes ofexplanation, numerous specific details are set forth in order to providean understanding of the claimed subject matter. It is evident, however,that the claimed subject matter can be practiced without these specificdetails. In other instances, structures and devices are illustrated inblock diagram form in order to facilitate describing the claimed subjectmatter.

FIG. 1 illustrates an example, according to some embodiments, of asystem 100 for performing design layout. The system 100 comprises adesign layout component 128. The design layout component 128 isconfigured to receive a netlist 102 describing connectivity of astandard cell that is to be laid out within a design layout 150. Forexample, the netlist 102 specifies that a via (A) 104 and a via (B) 106belong to a first net type, such that the via (A) 104 and the via (B)106 are allowed to be connected together, but not connected to vias ofother net types. The netlist 102 specifies that a via (C) 108 and a via(D) 110 belong to a second net type, such that the via (C) 108 and thevia (B) 110 are allowed to be connected together, but not connected tovias of other net types. The netlist 102 specifies that a via (X) 112belongs to a third net type, such that the via (X) 112 is not to beconnected to vias of other net types. The netlist 102 specifies that avia (E) 114, a via (F) 116, and a via (G) 118 belong to a fourth nettype, such that via (E) 114, via (F) 116, and via (G) 118 are allowed tobe connected together, but not connected to vias of other net types.

The netlist 102 specifies that a via (H) 120 belongs to a fifth nettype, such that the via (H) 120 is not to be connected to vias of othernet types. The netlist 102 specifies that a via (I) 122 belongs to asixth net type, such that the via (I) 122 is not to be connected to viasof other net types. The netlist 102 specifies that a via (J) 124 belongsto a seventh net type, such that the via (J) 124 is not to be connectedto vias of other net types. The netlist 102 specifies that a via (K) 126belongs to an eighth net type, such that the via (K) 126 is not to beconnected to vias of other net types.

The design layout component 128 is configured to generate the designlayout 150 based upon the netlist 102, such that the design layout 150is at least one of self-aligned double patterning (SADP) compliant orself-aligned multiple patterning (SAMP) compliant. In an example, thedesign layout 150 comprises a first connectivity ring 130 comprising afirst connectivity material type, such as mandrel. The firstconnectivity ring 130 provides connectivity to the via (A) 104, the via(B) 106, and the via (X) 112. Because the via (A) 104 and the via (B)106 belong to the first net type, while the via (X) 112 belongs to thethird net type, a first cut 152 and a second cut 154 are generated toisolate via (X) 112 from the via (A) 104 and the via (B) 106.

The design layout comprises a second connectivity ring 132 comprising asecond connectivity material type, such as a passive pattern. The secondconnectivity ring 132 provides connectivity to the via (E) 114, the via(F) 116, the via (G) 118, the via (J) 124, and the via (K) 126. Becausethe via (E) 114, the via (F) 116, and the via (G) 118 belong to thefourth net type, a third cut 156 and a fourth cut 158 are generated toisolate the via (E) 114, the via (F) 116, and the via (G) 118 from viasbelonging to other net types, such as the via (J) 124 and the via (K)126. In an example, the first cut 152 and the third cut 156 are mergedto create a first merged cut 140, and the second cut 154 and the fourthcut 158 are merged to create a second merged cut 138. A fifth cut 144 isgenerated to isolate the via (J) 124 and the via (K) 126 from oneanother because the via (J) 124 has a seventh net type, while the via(K) 126 has an eighth net type.

The design layout 150 comprises a third connectivity ring 134 comprisingthe first connectivity material type, such as mandrel. The thirdconnectivity ring 134 provides connectivity to the via (C) 108, the via(D) 110, and the via (I) 122. Because the via (C) 108 and the via (D)110 belong to the second net type, while the via (I) 122 belongs to thesixth net type, a sixth cut 146 and a seventh cut 148 are generated toisolate via (I) 122 from the via (C) 108 and the via (D) 110. The designlayout 150 comprises a fourth connectivity ring 136. The fourthconnectivity ring 136 provides connectivity to the via (H) 120. In thisway, the design layout 150 comprises one or more connectivity rings(e.g., formed according to an onion-based design) that providesconnectivity for vias without connecting vias of differing net typestogether for SADP compliance. It is appreciated that some embodiments ofgenerating the design layout 150 are described in further detail withregard to FIGS. 2-13.

An exemplary method 200 of performing design layout, according to someembodiments, is illustrated in FIG. 2, and exemplary design layoutsformed by such a methodology are illustrated in FIGS. 3-13. In example300 of FIG. 3, a design layout 150 initially comprises one or more vias,such that respective vias are restricted to a specific region. Forexample, the design layout 150 comprise a via (A) 104 of a first nettype, a via (B) 106 of the first net type, a via (C) 108 of a second nettype, a via (D) 110 of the second net type, a via (X) 112 of a third nettype, a via (E) 114 of a fourth net type, a via (F) 116 of the fourthnet type, a via (G) 118 of the fourth net type, a via (H) 120 of a fifthnet type, a via (I) 122 of a sixth net type, a via (J) 124 of a seventhnet type, and a via (K) of an eighth net type. Accordingly, one or moreconnectivity rings are formed (e.g., according to an onion-based design)within the design layout 150 to provide connectivity for vias, such thatthe design layout 150 is at least one of self-aligned double patterning(SADP) compliant or self-aligned multi patterning (SAMP) compliant.

At 202, a first connectivity ring 130 is generated within the designlayout 150. In example 400 of FIG. 4, the first connectivity ring 130 isgenerated within the design layout 150, such that the first connectivityring 130 connects the via (A) 104, the via (B) 106, and the via (X) 112.Because the first connectivity ring 130 provides connectivity for thevia (A) 104, the via (B) 106, and the via (X) 112, such vias arereferred to as ring one vias. In an example, the first connectivity ring130 comprises a power connectivity ring that connect to a VSS via (e.g.,the via (X) 112) and a VDD via (e.g., the via (A) 104, the via (B) 106,etc.). In an example, the first connectivity ring 130 is generated froma first connectivity material type, such as mandrel. In another example,the a first portion of the first connectivity ring 130 is formed from afirst mandrel type, while a second portion of the first connectivityring is formed from a second mandrel type different than the firstmandrel type (e.g., an SAMP design). In an example, a first spacer,having a substantially uniform width, is generated around the firstconnectivity ring 130.

At 204, responsive to the first connectivity ring 130 connecting a firstring one via to a second ring one via, where the first ring one via hasa net type that is different than a net type of the second ring one via,one or more cuts are applied to the first connectivity ring 130 toisolate the first ring one via from the second ring one via. In example500 of FIG. 5, a first cut 152 and a second cut 154 are generated alongthe first connectivity ring 130 in order to isolate the via (X) 112,having the first net type, from the via (A) 104 and the via (B) havingthe second net type. In an example where the first connectivity ring 130comprises a power connectivity ring, a power disconnect cut is appliedto the power connectivity ring to isolate one or more VSS vias from oneor more VDD vias.

At 206, a second connectivity ring 132 is generated within the designlayout 150. In example 600 of FIG. 6, the second connectivity ring 132is generated within the design layout 150, such that the secondconnectivity ring 132 connects the via (E) 114, the via (F) 116, the via(G) 118, the via (J) 124, and the via (K) 126. Because the secondconnectivity ring 132 provides connectivity for the via (E) 114, the via(F) 116, the via (G) 118, the via (J) 124, and the via (K) 126, suchvias are referred to as ring two vias. In an example, the secondconnectivity ring 132 is generated from a second connectivity materialtype, such as a passive pattern. In an example, a second spacer, havinga substantially uniform width, is generated around the secondconnectivity ring 132.

At 208, responsive to the second connectivity ring 132 connecting afirst ring two via to a second ring two via, where the first ring twovia has a net type that is different than a net type of the second ringtwo via, one or more cuts are applied to the second connectivity ring132 to isolate the first ring two via from the second ring two via. Inexample 700 of FIG. 7, a third cut 156 and a fourth cut 158 aregenerated along the second connectivity ring 132 in order to isolate thevia (E) 114, the via (F) 116, and the via (G) 118, having the fourth nettype, from vias having other net types, such as the via (J) 124 havingthe seventh net type and the via (K) 126 having the eighth net type. Inan example, the third cut 156 and the first cut 152 are merged to createa first merged cut 140, and the fourth cut 158 and the second cut 154are merged to a create a second merged cut 138. A fifth cut 144 isgenerated along the second connectivity ring 132 in order to isolate thevia (J) 124, having the seventh net type, and the via (K) 126 having theeighth net type.

In some embodiments, one or more additional connectivity rings aregenerated within the design layout 150. In example 800 of FIG. 8, athird connectivity ring 134 is generated within the design layout 150,such that the third connectivity ring 134 connects the via (C) 108, thevia (D) 110, and the via (I) 122. Because the third connectivity ring134 provides connectivity for the via (C) 108, the via (D) 110, and thevia (I) 122, such vias are referred to as ring three vias. In anexample, the third connectivity ring 134 is generated from the firstconnectivity material, such as mandrel. In an example, a third spacer,having a substantially uniform width, is generated around the thirdconnectivity ring 134. In example 900 of FIG. 9, a sixth cut 146 and aseventh cut 148 are generated along the third connectivity ring 134 toisolate the via (I) 122, having the sixth net type, from the via (C) 108and the via (D) 110 having the second net type. In example 1000 of FIG.10, a fourth connectivity ring 136 is generated within the design layout150. The fourth connectivity ring 136 provides connectivity for the via(H) 120. In some embodiments, one or more additional connectivity ringsare generated until respective vias within the design layout areconnected by at least one connectivity ring. Responsive to identifying afirst via having a net type that is different than a net type of asecond via that is adjacent to the first via, a cut is applied to atleast one corresponding connectivity ring to isolate the first via fromthe second via. In this way, one or more cuts are applied so thatisolation is provided between vias of different net types. In anembodiment, this is iteratively performed until no two vias of differentnet types are adjacent to one another without being isolated from oneanother.

In some embodiments, a cross-circle connector, such as a cross-ringwire, is generated to connect a connectivity ring with anotherconnectivity ring. In example 1100 of FIG. 11, a cross-circle connector1102 is generated between the first connectivity ring 130 and the thirdconnectivity ring 134. In an example, the cross-circle connector 1102 isgenerated because the first connectivity ring 130 and the thirdconnectivity ring 134 are both generated from the first connectivitymaterial. In another example, the cross-circle connector 1102 isgenerated based upon a width 1106 of a portion of the secondconnectivity ring 132 exceeding a width threshold. In an example, themerged cut 138 (e.g., merged cut 138 of FIG. 10) is replaced with a newcut 1104 along the first connectivity ring 130.

In some embodiments, a ring connector, such as a sub-ring wire, isgenerated between a first portion of a connectivity ring and a secondportion of the connectivity ring to form a first connectivity sub-ringand a second connectivity sub-ring. In example 1200 of FIG. 12, a firstconnectivity ring 1202 and a second connectivity ring 1204 are generatedwithin a design layout. The first connectivity ring 1202 providesconnectivity for one or more vias, such that vias of different net typesare not connected together. The second connectivity ring 1204 providesconnectivity for one or more vias, such as a first via 1206 and a secondvia 1208 having a first net type. In an example, the design layoutcomprises a third via 1210 having the first net type. However, the thirdvia 1210 is not initially connected by the second connectivity ring1204. Accordingly, connectivity is provided for the third via 1210 byway of a ring connector. In example 1300 of FIG. 13, a ring connector1302 is generated between a first portion of the second connectivityring 1204 and a second portion of the second connectivity ring 1204 toform a first connectivity sub-ring 1304 and a second connectivitysub-ring 1306. In an example, the ring connector 1302 is generated toconnect the third via 1210, having the first net type, with at least oneof the first via 1206 or the second via 1208 also having the first nettype.

According to an aspect of the instant disclosure, a method forperforming design layout is provided. The method comprises, generating afirst connectivity ring, from a first connectivity material type, withina design layout connect one or more ring one vias. Responsive to thefirst connectivity ring connecting a first ring one via to a second ringone via, where the first ring one via has a different net type than thesecond ring one via, a first cut to the first connectivity ring isapplied to the first connectivity ring to isolate the first ring one viafrom the second ring one via. A second connectivity ring is generated,from a second connectivity material type, within the design layout toconnect one or more ring two vias. Responsive to the second connectivityring connecting a first ring two via to a second ring two via, where thefirst ring two via has a different net type than the second ring twovia, a second cut is applied to the second connectivity ring to isolatethe first ring two via from the second ring two via.

According to an aspect of the instant disclosure, a system forperforming design layout is provided. The system comprises a designlayout component. The design layout component is configured to generatea first connectivity ring, within a design layout, that connects on ormore ring one vias. The first connectivity ring comprises mandrel orpassive pattern. The design layout component is configured to generate asecond connectivity ring, at least partially surrounded by the firstconnectivity ring within the design layout, which connects one or morering two vias. The second connectivity ring comprises a passive pattern.One or more cuts are generated within the design layout to isolate viashaving different net types.

According to an aspect of the instant disclosure, a self alignedpatterning compliant layout is provided. The self aligned patterningcompliant layout comprises one or more vias of a design layoutassociated with an electrical component, such as a standard cell. Theself aligned patterning compliant layout comprises one or moreconnectivity rings that connect respective vias. In an example, a firstconnectivity ring comprises a first via having a first via type and asecond via having a second via type. The first via is isolated from thesecond via based upon a first cut applied to the first connectivityring. In this way, the self aligned patterning compliant layoutcomprises one or more cuts. The self aligned patterning compliant layoutcomprises at least one of a cross-circle connector or a ring connector.The cross-circle connector is configured to connect a secondconnectivity ring to a third connectivity ring based upon the secondconnectivity ring and the third connectivity ring being formed of afirst connectivity material, such as mandrel or passive pattern. Thering connector is formed between the second connectivity ring and thethird connectivity ring to form a first connectivity sub-ring and asecond connectivity sub-ring.

Still another embodiment involves a computer-readable medium comprisingprocessor-executable instructions configured to implement one or more ofthe techniques presented herein. An exemplary computer-readable mediumthat may be devised in these ways is illustrated in FIG. 14, wherein theimplementation 1400 comprises a computer-readable medium 1416 (e.g., aCD-R, DVD-R, flash drive, a platter of a hard disk drive, etc.), onwhich is encoded computer-readable data 1414. This computer-readabledata 1414 in turn comprises a set of computer instructions 1412configured to operate according to one or more of the principles setforth herein. In one such embodiment 1400, the processor-executablecomputer instructions 1412 may be configured to perform a method 1410,such as at least some of the exemplary method 200 of FIG. 2, forexample. In another such embodiment, the processor-executableinstructions 1412 may be configured to implement a system, such as atleast some of the exemplary system 100 of FIG. 1, for example. Many suchcomputer-readable media may be devised by those of ordinary skill in theart that are configured to operate in accordance with the techniquespresented herein.

Although the subject matter has been described in language specific tostructural features and/or methodological acts, it is to be understoodthat the subject matter defined in the appended claims is notnecessarily limited to the specific features or acts described above.Rather, the specific features and acts described above are disclosed asexample forms of implementing the claims.

As used in this application, the terms “component,” “module,” “system”,“interface”, and the like are generally intended to refer to acomputer-related entity, either hardware, a combination of hardware andsoftware, software, or software in execution. For example, a componentmay be, but is not limited to being, a process running on a processor, aprocessor, an object, an executable, a thread of execution, a program,and/or a computer. By way of illustration, both an application runningon a controller and the controller can be a component. One or morecomponents may reside within a process and/or thread of execution and acomponent may be localized on one computer and/or distributed betweentwo or more computers.

Furthermore, the claimed subject matter may be implemented as a method,apparatus, or article of manufacture using standard programming and/orengineering techniques to produce software, firmware, hardware, or anycombination thereof to control a computer to implement the disclosedsubject matter. The term “article of manufacture” as used herein isintended to encompass a computer program accessible from anycomputer-readable device, carrier, or media. Of course, those skilled inthe art will recognize many modifications may be made to thisconfiguration without departing from the scope or spirit of the claimedsubject matter.

FIG. 15 and the following discussion provide a brief, generaldescription of a suitable computing environment to implement embodimentsof one or more of the provisions set forth herein. The operatingenvironment of FIG. 15 is only one example of a suitable operatingenvironment and is not intended to suggest any limitation as to thescope of use or functionality of the operating environment. Examplecomputing devices include, but are not limited to, personal computers,server computers, hand-held or laptop devices, mobile devices (such asmobile phones, Personal Digital Assistants (PDAs), media players, andthe like), multiprocessor systems, consumer electronics, mini computers,mainframe computers, distributed computing environments that include anyof the above systems or devices, and the like.

Although not required, embodiments are described in the general contextof “computer readable instructions” being executed by one or morecomputing devices. Computer readable instructions may be distributed viacomputer readable media (discussed below). Computer readableinstructions may be implemented as program modules, such as functions,objects, Application Programming Interfaces (APIs), data structures, andthe like, that perform particular tasks or implement particular abstractdata types. Typically, the functionality of the computer readableinstructions may be combined or distributed as desired in variousenvironments.

FIG. 15 illustrates an example of a system 1510 comprising a computingdevice 1512 configured to implement one or more embodiments providedherein. In one configuration, computing device 1512 includes at leastone processing unit 1516 and memory 1518. Depending on the exactconfiguration and type of computing device, memory 1518 may be volatile(such as RAM, for example), non-volatile (such as ROM, flash memory,etc., for example) or some combination of the two. This configuration isillustrated in FIG. 15 by dashed line 1514.

In other embodiments, device 1512 may include additional features and/orfunctionality. For example, device 1512 may also include additionalstorage (e.g., removable and/or non-removable) including, but notlimited to, magnetic storage, optical storage, and the like. Suchadditional storage is illustrated in FIG. 15 by storage 1520. In someembodiments, computer readable instructions to implement one or moreembodiments provided herein may be in storage 1520. Storage 1520 mayalso store other computer readable instructions to implement anoperating system, an application program, and the like. Computerreadable instructions may be loaded in memory 1518 for execution byprocessing unit 1516, for example.

The term “computer readable media” as used herein includes computerstorage media. Computer storage media includes volatile and nonvolatile,removable and non-removable media implemented in any method ortechnology for storage of information such as computer readableinstructions or other data. Memory 1518 and storage 1520 are examples ofcomputer storage media. Computer storage media includes, but is notlimited to, RAM, ROM, EEPROM, flash memory or other memory technology,CD-ROM, Digital Versatile Disks (DVDs) or other optical storage,magnetic cassettes, magnetic tape, magnetic disk storage or othermagnetic storage devices, or any other medium which can be used to storethe desired information and which can be accessed by device 1512. Anysuch computer storage media may be part of device 1512.

The term “computer readable media” may include communication media.Communication media typically embodies computer readable instructions orother data in a “modulated data signal” such as a carrier wave or othertransport mechanism and includes any information delivery media. Theterm “modulated data signal” may include a signal that has one or moreof its characteristics set or changed in such a manner as to encodeinformation in the signal.

Device 1512 may include input device(s) 1524 such as keyboard, mouse,pen, voice input device, touch input device, infrared cameras, videoinput devices, and/or any other input device. Output device(s) 1522 suchas one or more displays, speakers, printers, and/or any other outputdevice may also be included in device 1512. Input device(s) 1524 andoutput device(s) 1522 may be connected to device 1512 via a wiredconnection, wireless connection, or any combination thereof. In someembodiments, an input device or an output device from another computingdevice may be used as input device(s) 1524 or output device(s) 1522 forcomputing device 1512. Device 1512 may also include communicationconnection(s) 1526 to facilitate communications with one or more otherdevices.

Various operations of embodiments are provided herein. The order inwhich some or all of the operations are described should not beconstrued as to imply that these operations are necessarily orderdependent. Alternative ordering will be appreciated by one skilled inthe art having the benefit of this description. Further, it will beunderstood that not all operations are necessarily present in eachembodiment provided herein.

Moreover, “exemplary” is used herein to mean serving as an example,instance, illustration, etc., and not necessarily as advantageous. Asused in this application, “or” is intended to mean an inclusive orrather than an exclusive “or”. In addition, “a” and “an” as used in thisapplication are generally to be construed to mean “one or more” unlessspecified otherwise or clear from context to be directed to a singularform. Also, at least one of A and B or the like generally means A or Bor both A and B. Furthermore, to the extent that “includes”, “having”,“has”, “with”, or variants thereof are used in either the detaileddescription or the claims, such terms are intended to be inclusive in amanner similar to “comprising”.

Also, although the disclosure has been shown and described with respectto one or more implementations, equivalent alterations and modificationswill occur to others skilled in the art based upon a reading andunderstanding of this specification and the annexed drawings. Thedisclosure includes all such modifications and alterations and islimited only by the scope of the following claims.

What is claimed is:
 1. A method, comprising: generating a firstconnectivity ring to connect one or more ring one vias, the firstconnectivity ring comprising mandrel; generating a second connectivityring to connect one or more ring two vias, the second connectivity ringcomprising a passive pattern and at least partially surrounded by thefirst connectivity ring; and generating one or more cuts within at leastone of: the first connectivity ring to isolate a first ring one via ofthe one or more ring ones vias from a second ring one via of the one ormore ring ones vias; or the second connectivity ring to isolate a firstring two via of the one or more ring two vias from a second ring two viaof the one or more ring two vias.
 2. The method of claim 1, wherein thefirst ring one via has a net type that is different than a net type ofthe second ring one via.
 3. The method of claim 1, wherein the firstring two via has a net type that is different than a net type of thesecond ring two via.
 4. The method of claim 1, wherein: the generating afirst connectivity ring comprises generating the first connectivity ringwithin a design layout, and the generating a second connectivity ringcomprising generating the second connectivity ring within the designlayout.
 5. The method of claim 1, comprising: generating a thirdconnectivity ring connecting one or more ring three vias, the thirdconnectivity ring at least partially surrounded by the secondconnectivity ring,
 6. The method, of claim 5, wherein the thirdconnectivity ring comprises mandrel.
 7. The method of claim 5,comprising: generating a cross-circle connector to connect the firstconnectivity ring to the third connectivity ring.
 8. The method of claim7, the generating a cross-circle connector comprising: generating thecross-circle connector based upon a width of the second connectivityring exceeding a width threshold.
 9. The method of claim 1, comprising:generating a first spacer around the first connectivity ring, the firstspacer having a substantially uniform width.
 10. The method of claim 1,comprising: generating a ring connector between at least one of: a firstportion of the first connectivity ring and a second portion of the firstconnectivity ring to form a first connectivity sub-ring and a secondconnectivity sub-ring, or a first portion of the second connectivityring and a second portion of the second connectivity ring to form athird connectivity sub-ring and a fourth connectivity sub-ring.
 11. Themethod of claim 10, wherein the ring connector comprises a sub-ringwire.
 12. A system for performing design layout, comprising: a componentconfigured to: generate a first connectivity ring connecting one or morering one vias: generate a second connectivity ring connecting one ormore ring two vias, the second connectivity ring at least partiallysurrounded by the first connectivity ring; and generate one or more cutswithin at least one of the first conductivity ring or the secondconductivity ring to isolate vias having different net types.
 13. Thesystem of claim 12, wherein the component comprises a design layoutcomponent.
 14. The system of claim 12, wherein the first connectivityring comprises mandrel.
 15. The system of claim 12, wherein the secondconnectivity ring comprises a passive pattern.
 16. The system of claim12, wherein at least one of: a first cut of the one or more cuts iswithin the first connectivity ring to isolate a first ring one via ofthe one or more ring ones vias from a second ring one via of the one ormore ring ones vias, the first ring one via having a net type that isdifferent than a net type of the second ring one via, or a second cut ofthe one or more cuts is within the second connectivity ring to isolate afirst ring two via of the one or more ring two vias from a second ringtwo via of the one or more ring two vias, the first ring two via havinga net type that is different than a net type of the second ring two via.17. The system of claim 12, the component configured to: generate athird connectivity ring connecting one or more ring three vias, thethird connectivity ring at least partially surrounded by the secondconnectivity ring.
 18. The system of claim 17, wherein the firstconnectivity ring and the third connectivity ring comprise a firstconnectivity material type and the second connectivity ring comprises asecond connectivity material type, the first connectivity material typedifferent than the second connectivity material type.
 19. A method,comprising: generating a first connectivity ring within a design layout,the first connectivity ring connecting one or more ring one vias, thefirst connectivity ring comprising mandrel; generating a secondconnectivity ring within the design layout, the second connectivity ringconnecting one or more ring two vias, the second connectivity ringcomprising a passive pattern and at least partially surrounded by thefirst connectivity ring; and generating one or more cuts within at leastone of: the first connectivity ring to isolate vias, of the one or morering one vias, having different net types, or the second connectivityring to isolate vias, of the one or more ring two vias, having differentnet types.
 20. The method of claim 19, comprising generating a thirdconnectivity ring within the design layout, the third connectivity ringconnecting one or more ring three vias, the third connectivity ringcomprising mandrel and at least partially surrounded by the secondconnectivity ring.